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Packaging Of Microelectronics Expert Witness Listings

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Thomas J. Green

TJ Green Associates LLC

Bethlehem, Pennsylvania

Electronics Expert Witness, Medical Devices Expert Witness Hermeticity, Hermeticity Testing, Microelectronics, Failure Analysis of microelectronics, Cochlear Devices, Implanted Pulse Generators, IPGs, Mil-Std-883, TM 1014, Reliability, microcircuits, hybrids, optoelectronics, micro sensors, RF Modules, MMICs, Microwave modules, packaging of microelectronics
Additional Information Expert witness, consultant, and trainer in hermeticity and hermeticity testing of Class III medical implants and sensors. Experiencd expert witness at trial and deposition. Expertise in materials and processes used to assemble hybrids, MCMs (Multichip Modules), RF (Radio Frequency) and microwave modules, MEMS (Micro-Electro-Mechanical – Systems), Class III medical implants, optoelectronics, and other types of packaged microcircuits and sensors. Fellow of IMAPS (International Microelectronics and Packaging Society) with extensive leadership duties including 20+ years as chair of the IMAPS National Professional Development Courses and National Technical Committee member. Extensive experience in failure analysis of microcircuits and national and international teaching and training experience. Retired Lieutenant Colonel, United States Air Force Reserve with 28 years combined active and reserve duty at research labs focused on microelectronics packaging.